EN

TECHNICAL SUPPORT

技术支持

类型

Type

封装规格

Package

负载

Load Capacitance

(pF)

常温频差

Freq. Tol.@25℃

(ppm)

温度特性

Freq.Stability

(ppm)

温度范围

Temp. Range

特殊要求

Special

-

频率

Freq.

M 表晶32.768 

  Tuning Fork

C 贴片晶体谐振器

  Chip Quartz Crystal

G 贴片晶体谐振器

  Chip Quartz Crystal(Glass)

S 49US

A:1612

B:2016

C:2520

D:3215

E:3225

F:5032

G:6035

H:7050

K:8045

I:49S

J:49SMD

K:1x4

L:2x6

M:3x8

N:1610

P:2012

Q:6.9x1.4

R:8.0x3.8

X:12.5

A:6

B:7

C:8

D:9

E:10

F:12

G:15

H:16

I:18

J:20

K:22

L:25

M:30

N:32

P:50

O:No 

S:Series

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:0 ~ +40

B:0 ~ +50

C:0 ~ +60

D:0 ~ +70

E:0 ~ +80

F:0 ~ +85

G:-10 ~ +60

H:-20 ~ +70

I:-30 ~ +85

J:-40 ~ +85

K:-40 ~ +95

L:-40 ~ +105

M:-40 ~ +125

N:-40 ~ +150

P:-55 ~ +125

A:Auto

N:Non Auto

-

类型

Type

封装规格

Package

供应电压

Supply V(V)

三态

Tri-State Fun.

总频差

Freq. Stability

(ppm)

温度范围

Operating Temp. Range


输出信号模式

Output Logic 

And Symmetry

振荡模式

Oscillator

Mode

-

频率

Freq.

O 贴片晶体振荡器

  SMD Crystal Oscillator (CMOS)

L 贴片晶体振荡器

  SMD Crystal Oscillator (LVPECL/LVDS)

P 贴片编程晶体振荡器

  Programmable SMD Crystal Oscillator

V 贴片压控晶体振荡器

  SMD VCXO Crystal Oscillator

T 贴片温补晶体振荡器

  SMD TCXO Crystal Oscillator

A:1612

B:2016

C:2520

D:3215

E:3225

F:5032

G:6035

H:7050

K:8045

I:49S

J:49SMD

U:8038

V:6914

W:1610

X:2x6

Y:3X8

Z:14.2x9.3

E:2.8/3.0/3.3

J:2.5

K:1.8

P:1.5

L:1.2

M:0.9

T:Fixed-Freq With Tri-State

M:Multiplier-Freq With Tri-State(Only For F/H Package)

U:Ultra Low Noise Design

N:NA

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

P:±0.5

Q:±1.0

R:±1.5

S:±2.0

T:±2.5

U:±3.0

V:±3.5

W:±4.0

X:±4.5

A:0 ~ +40

B:0 ~ +50

C:0 ~ +60

D:0 ~ +70

E:0 ~ +80

F:0 ~ +85

G:-10 ~ +60

H:-20 ~ +70

I:-30 ~ +85

J:-40 ~ +85

K:-40 ~ +95

L:-40 ~ +105

M:-40 ~ +125

N:-40 ~ +150

P:-55 ~ +125

J:CMOS 15pF/50±5%

K:CMOS 15pF/50±10%

L:LVPECL/50±5%

V:LVDS/50±5%

M:HCSL/50±5%

N:HCMOS 15pF/50±5%

H:HCMOS 15pF/50±10%

A:AT 

T:AT 3rd Overtone


类型

Type

封装规格

Package

供应电压Supply V(V)

牵引范围

Pulling  Range

(ppm)

总频差

Freq. Stability

(ppb)

温度范围

Operating Temp.Range

输出信号模式

Output Logic 

And Symmetry

振荡模式

Oscillator

Mode

引脚分配

Pin out

含铅状态

Lead Free

-

频率

Freq.

N 恒温晶体振荡器

OCXO Crystal Oscillator

A:14.3x9.3

(SMD)

B:20.3x12,7

C:20.6x20.6

D:25.4x22.1

(SMD)

E:25.4x25.4

F:36.3x27.2

A:3.3

B:5

C:12

A:±0.2

B:±0.4

C:±1

D:±3

E:±5

F:No VC Function

A:±2

B:±5

C:±10

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:0 ~ +50

B:0 ~ +70

C:-30 ~ +70

D:-40 ~ +85

A:Sinewave

B:CMOS15pF/50±5%

H:Not

Not selectable by custome

N:Normal

"(Pleaserefer 

to ""outline drawing"""

F:RoSH Complian-

固定类型

Assembly type

标称频率

Nominal Freq.(KHz)

波束类型

Beam type

外壳种类

Case type

连接线种类

Wire type

UA:Passive combination probe

UB:Active combination probe(Analog)

UC:Active combination probe(Digital)

UD:Active combination probe(LIN-BUS,CAN-BUS)

UE:Closed sensor core(T/R)

UK:Open sensor core(T/R)

UT:Open sensor core(T)

UR:Open sensor core(R)

DM:Matching layer Closed sensor core

40:40.0

48:48.0

52:52.0

55:55.5

58:58.0

62:62.0

68:68.0

2H:200

3H:300

4H:400

1M:1000

S:Symmetric

X=Y

D:Dissymmetric 

X>Y

A:14x9 Aluminum case

B:15x9 Aluminum case

C:15.5x9 Aluminum case

D:16x12 Aluminum case

E:16x12 Plastic case

F:18.7x10.5(DM)

G:13.0x9.0(DM)

H:11.0x10.0(DM)

L:Plastic composite housing(Plane)

M:Plastic composite housing(Dip angle)

S:Customer-specified

N:Not specified

1:Stranded wire with Terminal

2:Screw waterproof joint wire(2.5M)

3:Standard shielded wire(2.5M)

4:Pin

5:AV cable

9:Customer-specified

0:Not specified